Method for forming metal line of semiconductor device

ABSTRACT

A method for forming a metal line of a semiconductor device uses a low dielectric constant material as an interlayer dielectric layer and treats a surface of the interlayer dielectric layer with plasma to prevent moisture and ammonia from being adsorbed in the low dielectric constant material. The method for forming a metal line of a semiconductor device includes forming a lower metal line layer on a semiconductor substrate, sequentially forming an etch stop layer and an interlayer dielectric layer on an entire surface including the lower metal line layer, forming a plasma layer by treating a surface of the interlayer dielectric layer with plasma, forming a photoresist pattern on the plasma layer, forming a via hole using the photoresist pattern as a mask to open the lower metal line layer, and forming a via contact by burying a metal material in the via hole.

This application claims the benefit of the Korean Patent Application No.P2005-0093464, filed on Oct. 5, 2005, which is hereby incorporated byreference in its entirety.

BACKGROUND

1. Technical Field

The present invention relates to a method for forming a semiconductordevice, and more particularly, to a method for forming a metal line of asemiconductor device in which a low dielectric constant material is usedas an interlayer dielectric layer and a surface of the interlayerdielectric layer is treated with plasma to prevent moisture and ammoniafrom being adsorbed in the low dielectric constant material.

2. Discussion of the Related Art

Recently, the number of devices integrated into one fingernail-sizedsemiconductor chip has approached, and in some cases exceeded, 1×10⁹.This number of devices integrated into one semiconductor chip increasesby geometrical progression. To obtain both high-integration and ahigh-speed in such a device, it is necessary to improve the developmentthe semiconductor chip in both structural and material aspects. Theimprovement in the structure of the semiconductor chip involves anincrease in the number of metal layers. Also, a shallow trench isolation(STI) method is used for isolation between the devices. In such devices,the semiconductor chip is formed of materials including copper (Cu) andlow-dielectric materials (Low-k).

Particularly, with the increase of high integration of a semiconductordevice, the distance between metal lines has become gradually narrowedand metal lines having a multilevel structure have been required.Parasitic capacitance and parasitic resistance components existingeither between adjacent metal line layers on one layer or betweenadjacent lower or upper metal line layers have arisen as importantproblems. The need for a multilevel metal line having minimal parasiticcapacitance and parasitic resistance components has been required in themanufacture of a high integrated semiconductor device having improvedoperational speed.

To form metal lines having reduced parasitic capacitance and parasiticresistance components, either metal having a low specific resistancesuch as Cu or a material having a low dielectric ratio such as low-kdielectric material is required as a metal line material.

Particularly, Cu has advantages in view of low specific resistance, lowcost and simplified process. Also, Cu has demonstrated electro-migrationeffects better than that of aluminum by at least ten times.

Instead of existing SiO₂, a low dielectric constant material may be usedto reduce power consumption and improve the speed of a semiconductordevice. A material having a dielectric constant value ‘k’ less than 3 isused in a semiconductor device having a line width of 90 nm or below.

Hereinafter, a related art method for forming a metal line of asemiconductor device will be described with reference to theaccompanying drawings.

FIG. 1A to FIG. 1E are sectional views illustrating related art processsteps of forming a metal line of a semiconductor device.

First, as shown in FIG. 1A, an etch stop layer 12 is deposited on asemiconductor substrate in which a lower metal line layer 11 is formed.An interlayer dielectric layer 13 is thickly formed on the etch stoplayer 12.

The etch stop layer 12 is formed of SiN, SiC, SiCN, or SiCO, and theinterlayer dielectric layer 13 is formed of phosphorous silicate glass(PSG), boron phosphorous silicate glass (BPSG), undoped silicate glass(USG), fluorine doped silicate glass (FSG), SiOC, high density plasma(HDP), plasma enhanced-tetra ethyl ortho silicate (PE-TEOS), or spin onglass (SOG).

However, in a semiconductor device of 0.13 μm or less, Cu is used as ametal line layer and a low dielectric constant material such as low-kdielectric material is typically used as the interlayer dielectric layer13 to minimize parasitic capacitance and parasitic resistancecomponents.

At this time, if the low dielectric constant material is used as theinterlayer dielectric layer, SiO₂ is deposited on the interlayerdielectric layer 13 to additionally form a capping layer 15. that thecapping layer becomes necessary because the low dielectric constantmaterial has a low density and thus will adsorb a gas including moistureand ammonia in the air. The capping layer 15 serves to prevent the lowdielectric constant material from adsorbing the gas.

Next, as shown in FIG. 1B, a photoresist is deposited on the interlayerdielectric layer 13 and then patterned by exposing and developingprocesses to form a photoresist pattern 14 so that a region for a viahole is opened.

Afterwards, as shown in FIG. 1C, the capping layer 15 and the interlayerdielectric layer 13 are sequentially dry etched using the photoresistpattern 14 as an etching mask to form the via hole 16. As a result, theetch stop layer 12 is exposed through the via hole 16.

Subsequently, as shown in FIG. 1D, the photoresist pattern 14 is removedby an ashing process and the etch stop layer 12 exposed through the viahole 15 is etched to open the lower metal line layer 11.

Then, the opened via hole 16 is filled with a metal material 17 such asCu so that the metal material 17 contacts the lower metal line layer 11through the via hole 16.

Finally, as shown in FIG. 1E, the overfilled metal material 17 isplanarized by a chemical mechanical polishing (CMP) process. In thiscase, the metal material 17 is removed by the CMP process until thecapping layer 15 is exposed. Thus, a via contact 20 that contacts thelower metal line layer 11 is formed. The lower metal line layer 11 willbe electrically connected to an upper metal line layer to be formedlater, through the via contact 20.

However, the related art method for forming a metal line of asemiconductor device has several problems.

Since the low dielectric constant material used as the interlayerdielectric layer can adsorb a gas including moisture and ammonia in theair, any ammonia adsorbed in the low dielectric constant material duringthe process is externally emitted which will disturb the patterningprocess for forming the metal line. This will prevent the properformation of a metal line, which can adversely affect the yield. Also,if the low dielectric constant material adsorbs any moisture, adielectric constant value of the low dielectric constant material willincrease, further deteriorating characteristics of the device.

The capping layer is additionally deposited on the interlayer dielectriclayer of the low dielectric constant value to prevent moisture andammonia from being adsorbed in the interlayer dielectric constantmaterial. However, since the capping layer is formed of SiO₂ having ahigh dielectric constant value, parasitic capacitance is increasedbetween a lower metal and an upper metal, thereby also deteriorating theperformance of the device.

A photoresist less responsive to ammonia may be used as the interlayerdielectric layer. However, such a photoresist is expensive and thusincreases the process cost.

SUMMARY

Consistent with the present invention, there is provided a method forforming a metal line of a semiconductor device, which substantiallyobviates one or more problems due to limitations and disadvantages ofthe related art.

Consistent with the present invention there is further provided a methodfor forming a metal line of a semiconductor device in which a lowdielectric constant material is used as an interlayer dielectric layerand a surface of the interlayer dielectric layer is treated with plasmato prevent moisture and ammonia from being adsorbed in the lowdielectric constant material.

Consistent with a purpose of the invention, as embodied and broadlydescribed herein, there is further provided a method for forming a metalline of a semiconductor device includes forming a lower metal line layeron a semiconductor substrate, sequentially forming an etch stop layerand an interlayer dielectric layer on an entire surface including thelower metal line layer, forming a plasma layer by treating a surface ofthe interlayer dielectric layer with plasma, forming a photoresistpattern on the plasma layer, forming a via hole using the photoresistpattern as a mask to open the lower metal line layer, and forming a viacontact by burying a metal material in the via hole.

The method for forming a metal line of a semiconductor device may becharacterized in that instead of depositing a capping layer thatdeteriorates performance of the device, a low dielectric constantmaterial is used as the interlayer dielectric layer and the surface ofthe interlayer dielectric layer is treated with plasma to preventmoisture and ammonia from being adsorbed in the low dielectric constantmaterial. The surface of the interlayer dielectric layer is treated withplasma in such a manner that a thin SiO₂ layer is formed using O₂ gas ora SiN, SiCN, SiCO or SiON layer may be formed using NH₃ gas. Since thesurface of the interlayer dielectric layer is treated with plasmawithout forming the capping layer, it is possible to improveproductivity. In addition, since no expensive photoresist is required,it is possible to select the photoresist within a wider range.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this application, illustrate embodiments consistent with theinvention and together with the description serve to explain theprinciple of the invention. In the drawings:

FIG. 1A to FIG. 1E are sectional views illustrating related art processsteps of forming a metal line of a semiconductor device; and

FIG. 2A to FIG. 2E are sectional views illustrating process steps offorming a metal line of a semiconductor device consistent with thepresent invention.

DETAILED DESCRIPTION

Reference will now be made in detail to the preferred embodimentsconsistent with the present invention, examples of which are illustratedin the accompanying drawings. Wherever possible, the same referencenumbers will be used throughout the drawings to refer to the same orlike parts.

FIG. 2A to FIG. 2E are sectional views illustrating process steps offorming a metal line of a semiconductor device consistent with thepresent invention.

As shown in FIG. 2A, an etch stop layer 112 is deposited on asemiconductor substrate in which a lower metal line layer 111 is formed.

The semiconductor substrate may be a silicon wafer substrate. Thesemiconductor substrate may be another material layer including aspecial conductive layer including an impurity doping region formed inthe semiconductor substrate, a metal line layer of Cu, or otherconductive pattern.

The etch stop layer 112 is preferably formed of a material having a highetch selectivity ratio to an interlayer dielectric layer 113 formed onthe etch stop layer. For example, the etch stop layer 112 may be formedof SiN, SiC, SiCN, or SiCO. The etch stop layer 112 may be formed at athickness of about 200 Å to 1000 Å, preferably about 500 Å. The etchstop layer 112 serves to prevent a metal material of the lower metalline layer 111 from diffusing into the interlayer dielectric layer,formed in a later step.

Next, an interlayer dielectric layer 113 is thickly formed on the etchstop layer 112. The interlayer dielectric layer 113 may be formed insuch a manner that a low-k material having a dielectric constant valueof 3 or less is deposited. The interlayer dielectric layer 113 may beformed at a thickness of about 1500 Å to 15000 Å, preferably about 3000Å to 5000 Å.

A surface of the interlayer dielectric layer 113 is. treated with plasmausing O₂ gas to form a thin plasma layer 115 on the interlayerdielectric layer 113. The thin plasma layer 115 serves to preventmoisture or ammonia in the air from being diffused or adsorbed into theinterlayer dielectric layer. 113.

If the interlayer dielectric layer 113 is treated with O₂ plasma asabove, the plasma layer 115 becomes a SiO₂ layer. At this time, inaddition to O₂, He, H₂, Ar, CO or N₂ may be used.

Meanwhile, the surface of the interlayer dielectric layer 113 may betreated with plasma using a gas. including NH₃. In this case, the plasmalayer 115 becomes a SiN, SiCN, SiCO, or SiON layer. At this time, inaddition to NH₃, He, H₂, Ar, CO or N₂ may be used.

The surface of the interlayer dielectric layer 113 is treated withplasma at a temperature of about 30° C. to 400° C., power of about 1 Wto 10 KW, and pressure of about 0.1 torr to 10 torr.

Next, as shown in FIG. 2B, a photoresist is deposited on the plasmalayer 115 and then patterned by exposing and developing processes toform a photoresist pattern 114 so that a region for a via hole isopened. At this time, impurities of the photoresist may diffuse into theinterlayer dielectric layer having a low density if a plasma layer isnot inserted between the interlayer dielectric layer and the photoresistpattern. However, by forming the plasma layer 115, it is possible toprevent the impurities from diffusing into the interlayer dielectriclayer 113. Therefore, since an expensive photoresist having noimpurities is not required, it is possible to select the photoresistwithin a wider range.

Afterwards, as shown in FIG. 2C, the plasma layer 115 and the interlayerdielectric layer 113 are removed using the photoresist pattern 114 as anetching mask to form the via hole 116. As a result, the etch stop layer112 is exposed through the via hole 116. The plasma layer issimultaneously removed along with the interlayer dielectric layer due toits thinness.

Subsequently, as shown in FIG. 2D, the photoresist pattern 114 isremoved by an ashing process. A dry etching process may be used as theashing process. The dry etching process may be classified into one basedon O₂ plasma discharge and another one based on O₃. The O₂ plasma ashingprocess removes the photoresist by reacting a byproduct of O₂ plasma,i.e., O₂ radical with an organic matter, i.e., the photoresist, togenerate CO₂ and then pumping CO₂ out using a vacuum pump. By contrast,the O₃ ashing process removes the photoresist under a normal pressure byusing a strong, oxidation reaction of O₃. Consistent with the presentinvention, the ashing process is not limited to the O₂ plasma ashingprocess or the O₃ ashing process. Another ashing process may be usedconsistent with the present invention.

Then, the etch stop layer 112 exposed through the via hole 116 is etchedto externally expose the lower metal line layer 111.

Subsequently, the via hole 116 is filled with a metal material 117 sothat the metal material 117 contacts the lower metal line layer 111through the via hole 116. Either a metal having low specific resistance,such as Cu, Al, Ag and Au, or their alloys, may be used as the metalmaterial 117. Cu is preferably used in a semiconductor device of highintegration.

At this time, an antidiffusion layer may further be provided to preventthe metal material from being diffused. Either a single layer, such asTa, TaN, W, WN, Ti, and TiN, or their composite layer may be used as theantidiffusion layer. The antidiffusion layer is preferably formed at athickness of about 100 Å to 1000 Å.

Afterwards, a planarization process is performed using a CMP process.That is, the metal material 117 and the plasma layer 115 are removed bythe CMP process until the interlayer dielectric layer 113 is exposed. Ifthe plasma layer 115 is not removed, parasitic capacitance may begenerated between the lower metal line layer and an upper metal linelayer. Therefore, the plasma layer 115 is also removed when the metalmaterial 117 is removed.

Thus, as shown in FIG. 2E, a via contact 120 of a single damascenestructure is completed. Although not shown, the upper metal line layer(not shown) is formed on the via contact 120 and electrically connectedwith the lower metal line layer 111.

Afterwards, an antidiffusion layer (not shown) may further be formed onthe entire surface including the via contact if necessary. Theantidiffusion layer is formed of SiN, SiC, or so on at a thickness ofabout 500 Å to 1000 Å.

As described above, the method for forming a metal line of asemiconductor device according to the present invention has thefollowing advantages.

In the semiconductor device of high integration, which uses the lowdielectric constant material as the interlayer dielectric layer, insteadof depositing a capping layer, the surface of the interlayer dielectriclayer is treated with plasma to prevent moisture and ammonia from beingadsorbed in the low dielectric constant material. Thus, the plasma layeris formed on the interlayer dielectric layer so that the interlayerdielectric layer can be protected from moisture and ammonia in the air.Since the surface of the interlayer dielectric layer is treated withplasma without forming the capping layer, it is possible to improveproductivity. In addition, since no expensive photoresist is required,it is possible to select the photoresist within a wider range.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the inventions. Thus, itis intended that the present invention covers the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. A method for forming a semiconductor device, the method comprising:forming a lower metal line layer on top of and in direct contact with asemiconductor substrate; forming an etch stop layer of at least one ofSiN, SiC, SiCN, and SiCO, on top of and in direct contact with the lowermetal line layer; forming an interlayer dielectric layer on top of andin direct contact with the etch stop layer; forming a plasma layer ontop of and in direct contact with the interlayer dielectric layer bytreating the surface of the interlayer dielectric layer with plasma at atemperature of 30° C. to 400° C., wherein forming the plasma layercomprises treating the surface of the interlayer dielectric layer withplasma using O₂ gas; forming a photoresist pattern on top of and indirect contact with the plasma layer; removing the plasma layer and theinterlayer dielectric layer using the photoresist pattern as a mask toform a via hole exposing the etch stop layer; removing the etch stoplayer externally exposing the lower metal line layer; forming a metalmaterial on the plasma layer and in the via hole; forming a firstantidiffusion layer on the metal material; removing the firstantidiffusion layer, the metal material, and the plasma layer by a CMPprocess until the interlayer dielectric layer is exposed to form a viacontact in the via hole; and forming a second antidiffusion layer overthe interlayer dielectric layer and via contact following the CMPprocess.
 2. The method as claimed in claim 1, wherein forming the plasmalayer further comprises treating the surface of the interlayerdielectric layer with plasma using He, H₂, Ar, Co, or N₂ in addition toO₂.
 3. The method as claimed in claim 1, wherein forming a plasma layercomprises forming a SiO₂ layer.
 4. The method as claimed in claim 1,wherein forming the plasma layer comprises treating the surface of theinterlayer dielectric layer with plasma at a power of about 1 W to 10KW.
 5. The method as claimed in claim 1, wherein forming the plasmalayer comprises treating the surface of the interlayer dielectric layerwith plasma at a pressure of about 0.1 torr to 10 torr.
 6. The method asclaimed in claim 1, wherein forming the lower metal line layer comprisesforming a lower line layer of Cu.
 7. The method as claimed in claim 1,wherein forming the interlayer dielectric layer comprises forming alayer of low-k dielectric material.
 8. The method as claimed in claim 1,wherein forming the interlayer dielectric layer comprises forming alayer of low-k dielectric material having a dielectric constant value of3 or less.
 9. The method as claimed in claim 1, further comprisingplanarizing the metal material using a CMP process after burying themetal material in the via hole.
 10. The method as claimed in claim 1,wherein forming the first antidiffusion layer comprises forming a layercomprising at least one of Ta, TaN, W, WN, Ti, TiN, or a compositethereof.
 11. A method for forming a semiconductor device, the methodcomprising: forming a lower metal line layer on top of and in directcontact with a semiconductor substrate; forming an etch stop layer of atleast one of SiN, SiC, SiON, and SiCO, on top of and in direct contactwith the lower metal line layer; forming an interlayer dielectric layeron top of and in direct contact with the etch stop layer; forming aplasma layer on top of and in direct contact with the interlayerdielectric layer by treating the surface of the interlayer dielectriclayer with plasma at a temperature of 30° C. to 400° C., wherein formingthe plasma layer comprises treating the surface of the interlayerdielectric layer with plasma using NH₃ gas; forming a photoresistpattern on top of and in direct contact with the plasma layer; removingthe plasma layer and the interlayer dielectric layer using thephotoresist pattern as a mask to form a via hole exposing the etch stoplayer; removing the etch stop layer externally exposing the lower metalline layer; forming a metal material on the plasma layer and in the viahole; forming a first antidiffusion layer on the metal material;removing the first antidiffusion layer, the metal material, and theplasma layer by a CMP process until the interlayer dielectric layer isexposed to form a via contact in the via hole; and forming a secondantidiffusion layer over the interlayer dielectric layer and via contactfollowing the CMP process.
 12. The method as claimed in claim 11,wherein forming the plasma layer further comprises treating the surfaceof the interlayer dielectric layer with plasma using He, H₂, Ar, Co, orN₂ in addition to NH₃.
 13. The method as claimed in claim 11, whereinforming the plasma layer comprises forming a layer of at least one ofSiN, SiON, SiCO or SiON.